Cosmic DAP molding compounds possess superior electronic insulation, even under the most adverse environmental conditions.
These compounds are easy to mold and have no outgassing. They can be molded in compression, transfer, or injection equipment.
Cosmic DAP compounds are non-corrosive to inserts and resistant to weathering, fungus, and most solvents.
Fully cured parts manufactured from Cosmic DAP possess unsurpassed dimensional stability, even under load. They withstand solder temperature and will not creep after curing. That is why this state of the art material is used extensively in the space program, the connector and the electronics industries.
Offered in a variety of colors and flows, Cosmic DAPs do not require cold storage and have an average shelf life of one year at 23 ° C.